EFI and Highcon have agreed a new global partnership, aimed at their common customers in the printed packaging market and promising them an ‘integrated end-to-end productivity and workflow solution’.
Centred on EFI’s Packaging and Corrugated Suites of MIS/ERP and workflow software, plus its MarketDirect PackCentral web-to-print portal and AutoCount 4D shopfloor data collection software, the new arrangement will also see forthcoming releases of Highcon’s Euclid and Beam cutter/folder system software integrate directly with PackCentral. Collectively, the combination should reduce waste and inefficiency in packaging production and so improve lead times for printed material development. The companies describe this as ‘a fully optimised supply chain that brings together buyers, converters and digital converting equipment through robust two-way connectivity.’
‘We see the digital corrugated market as being a strong growth area,’ explained Ken Hanulec, EFI’s vice president of worldwide marketing. ‘The EFI Nozomi solutions have really begun revolutionising the industry and as part of our holistic view of the marketplace we identified Highcon as being the leader in the next step in the digital process – digital finishing. Their digital cutting and creasing solutions enable the kind of on-demand production that drives customer success. We are excited about the potential of addressing the market together.’
Highcon CEO Shlomo Nimrodi added, ‘We are excited about working with EFI towards a genuinely end-to-end digital solution. Nozomi and Beam platforms, coupled with workflow automation that will answer the market needs for sustainability and Industry 4.0 manufacturing efficiencies. Collaboration with other industry players in the digital space is a critical part of our go to market strategy and we will continue to drive this strategy demonstrating our commitment to provide the best comprehensive solution to the inherent limitations in the conventional process.’
